Welcome to EMBC 2013: The 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society
It’s here, it’s time…to submit your contributed papers to EMBC’13! The Organizing Committee would like to announce that the paper management system is now open for paper submission.
The 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC’13) is coming earlier and will take place 3-7 July 2013, at the Osaka International Convention Center, in Osaka, Japan.
The conference will cover diverse topics such as biomedical engineering, healthcare technologies, and medical and clinical applications. The conference program will consist of invited plenary lectures, symposia, workshops, invited sessions and oral and poster sessions of unsolicited contributions. All papers will be peer reviewed; accepted papers of up to four pages will appear in the Conference Proceedings and be indexed by IEEE Xplore and Medline/PubMed.
Detailed information about the 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society can be found at the conference website.
Deadline for submission is Monday, 21 January 2013.