Estimating the finger forces from surface electromyography (sEMG) is essential for diverse applications (e.g., human-machine interfacing). The performance of pre-trained sEMG-force models degenerates significantly when applied on a second day, due to the large cross-day variation of sEMG characteristics. Previous studies mainly employed transfer learning algorithms to tackle this problem. However, transfer learning algorithms normally require data collected on the second day for model calibration, increasing the inconvenience in practical use. In this work, we investigated the effect of model regularization on this issue. Specifically, 256-channel high-density sEMG (HDsEMG) signals with varying finger forces were collected on different days (3–25 days apart). We applied randomly generated channel perturbations (“masks”) to feature maps of randomly selected channels in training dataset. The channel masks of the training set were generated randomly and independently in each narrow time window (~20 ms). We assumed that by learning from randomly masked feature maps (randomness is the central aspect), the model would not be biased by a small number of features but would be based on learning from a global perspective, therefore avoiding overfitting to the within-day EMG patterns. Moore-Penrose inverse model regularization was also employed as a baseline method, with results showing that cross-day EMG-force models require a higher tolerance parameter compared with within-day applications. In combination with the Moore-Penrose inverse model regularization, further applying random channel masks to the training set significantly improved model performance in cross-day validation.
Random Channel Masks for Regularization of Least Squares-Based Finger EMG-Force Modeling to Improve Cross-Day Performance https://www.embs.org/tnsre/wp-content/themes/movedo/images/empty/thumbnail.jpg 150 150 Transactions on Neural Systems and Rehabilitation Engineering (TNSRE) //www.embs.org/tnsre/wp-content/uploads/sites/15/2022/06/ieee-tnsre-logo2x.png
Sign-in or become an IEEE member to discover the full contents of the paper.