Mehmet Dokmeci

Expertise: Biomicroelectromechanical systems, biosensors, organs on a chip, flexible electronics, 3D bioprinting, and implantable devices. 

Mehmet R. Dokmeci received B.S. (with distinction) and M.S. degrees from the University of Minnesota, Minneapolis, and a Ph.D. degree from the University of Michigan, Ann Arbor, all in Electrical Engineering. Dr. Dokmeci has been an Associate Professor at the Terasaki Institute for Biomedical Innovation (TIBI) since July 2020. Before TIBI, he was an Adjunct Associate Professor in the Radiology Department at the University of California-Los Angeles from November 2017 to June 2020. Prior to UCLA, he was an Instructor at Brigham and Women’s Hospital, Harvard Medical School. Previously, he was on the faculty of the Electrical and Computer Engineering Department at Northeastern University. Before joining academia, he worked at Corning-Intellisense Corporation, Wilmington, MA, developing MEMS-based products for the telecommunications and life science industries from 2000 to 2003. He has extensively published in refereed journals and conferences in the areas of BioMEMS, micro and nanoscale sensors and systems, biomedical and implantable devices, biofabrication, and organs-on-a-chip. He has also been actively involved in research areas such as flexible electronics for monitoring and modulation of wound healing, electrical/electrochemical biosensors for monitoring organs-on-a-chip systems, and 3D bioprinting. He has served as a conference/workshop organizer and session chair for several conferences, including IEEE Engineering in Medicine and Biology Society and Materials Research Society Meetings. He is a Section Editor for the journal Micromachines. He has authored more than 200 peer-reviewed scientific publications and has over 100 abstract presentations, has an h-index=94, and his publications have received more than 34,800 citations.