CMOS

Flexible intracortical neural probes elicit a lower tissue response compared to rigid implants. However, silicon-based neural probes incorporating complementary metal-oxide-semiconductor (CMOS) circuitry offer improved scalability and functionality. We describe a novel neural implant combining short, needle-like CMOS-based probe tips with flexible polyimide cables. Ultra-thin shuttles enable their complete implantation into brain tissue. An optimized cable fabrication process based on ion beam and plasma etching increases line and pad density, thus minimizing the bond area between cable and probe tip to widths of 100 µm. The synergetic approach surpasses the limitations of each individual probe technology and should be considered in future developments. read more